Update: Innovation Direct™ receives response from president of Washington-based Innovation Direct To Industry™ company; non-disclosure agreement for 8 inventions sent…

Good afternoon, Juan C. Blanco, Innovation Direct™’s Director of Product Licensing, checking in with a follow-up on a situation we just reported on in an October 6th entry (“Update: Innovation Direct™ seeks feedback from Washington-based Innovation Direct To Industry™ company regarding 8 inventions sent…“). We are pleased to report that we’ve received a response from the president of the Washington-based consumer electronics products company that we’d originally met at the ASI Show Chicago 2008 event, and that was the subject of the aforementioned entry.

As per the communication received from the company president, they are open to reviewing detailed design information on all 8 of the inventions in their initial Innovation Direct To Industry™ package under a non-disclosure agreement. Accordingly, the Innovation Direct™ representative managing the situation has already prepared and sent the document to the company for signature via e-mail, and we are hopeful of receiving it in return with a signature before the end of the day on Tuesday.

Stay tuned to the Innovation Direct™ Blog for the latest on this developing situation!

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